Syenta has developed a breakthrough advanced packaging process technology - Localized Electrochemical Manufacturing (LEM). LEM addresses the critical AI memory bandwidth bottleneck by enabling high-resolution copper interconnects. Our technology can overcome existing chip design constraints and potentially increase chip bandwidth by up to 10x, while reducing cycle times, process steps, emissions and waste.


Arizona, USA

Eindhoven, Netherlands

Sydney NSW, Australia

Syenta

MPC Ventures Pty Ltd

OIF Ventures

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