Enabling the transition to 2.5D and 3D chiplet stacking and increasing the performance of semiconductor chips to meet the growing demand.

Marketing & Communications

Software Engineering

Other Engineering

Design

New South Wales, Australia

Arizona, USA

Eindhoven, Netherlands

Canberra, Australia

Australian Capital Territory, Australia

Sydney, NSW, Australia

Sydney NSW, Australia

Syenta

MPC Ventures Pty Ltd

OIF Ventures

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