About Syenta

Syenta is pioneering a new era in semiconductor manufacturing with our groundbreaking Localised Electrochemical Metallization (LEM) technology. Our manufacturing platform enables cutting-edge advanced packaging by combining patterning and metallization into a single tool. We deliver high-speed, high-resolution metallization at significantly lower cost and energy use, while reducing emissions and waste.

Join an innovative Australian startup poised to revolutionise advanced packaging in the semiconductor industry.

About The Role

Syenta is seeking a highly technical and execution-focused Process Development Team (PDT) Lead to develop and optimise materials and surface processes enabling our LEM technology.

This role focuses on materials process development, surface treatment, contamination control, defect characterisation, and yield engineering within advanced semiconductor packaging. The successful candidate will establish materials characterisation and inspection methodologies, develop structured frameworks for materials-driven defect analysis, and drive process optimisation and yield improvement through deep understanding of materials behaviour and surface interactions.

Responsibilities

• Lead development and optimisation of materials and surface treatment processes, including cleaning and contamination control for LEM integration
• Establish materials characterisation and metrology methodologies to evaluate surface condition, contamination levels, and process stability
• Develop structured frameworks for materials defect analysis and failure characterisation
• Baseline materials process data and define process windows influencing materials performance and yield
• Execute statistical analysis and design-of-experiments (DOE) to identify materials-related root causes and corrective actions
• Analyse materials behaviour and defect mechanisms impacting device performance and yield
• Monitor yield trends and implement materials-driven process optimisation strategies
• Collaborate with internal teams and external partners to demonstrate materials process capability and integration readiness
• Present technical findings and materials performance analysis to leadership and external stakeholders
• Drive development milestones for materials process integration under aggressive timelines
  
  

Requirements

• Master’s degree in Mechanical Engineering, Electrical Engineering, Materials Engineering, Chemistry, Chemical Engineering, or related field
• 5+ years of experience in semiconductor manufacturing or operations
• 5+ years of experience in technology development, preferably within advanced packaging
• Strong knowledge of metrology tools and inspection applications in semiconductor environments
• Demonstrated experience in yield analysis, DOE, and root cause investigation
• Strong presentation and communication skills, including translating complex processes for varied audiences
• Proven ability to lead and mentor technical teams
  
  

Preferred Qualifications

• Ph.D. in a relevant engineering or science discipline
• Experience working directly with semiconductor customers or external partners
• Background in defect density reduction and electrical performance optimisation
• Experience operating in a high-growth or startup environment
  
  

Why Choose Syenta?

We’re passionate about building a diverse, people-first company. We believe that a culture of collaboration and mutual respect fuels innovation capable of redefining an industry.

What We Offer

Salary Range: AUD $140k – $160k+ (negotiable)

Equity: ESOP options available

• Professional growth as the company scales
• Flexible leave policies supporting work-life balance
• Opportunity to help shape the infrastructure of a deep-tech manufacturing company from the ground up
  
  

If you’re excited to take on this challenge in advanced packaging development, we want to hear from you — even if you don’t tick every box.

Apply here or send your CV and a short note to careers@syenta.com for more information.