What is the problem

A critical step of Syenta's LEM process is the LEM stamp placement. In this step, the LEM stamp is adhered to the customer substrate through a thin layer of electroplating solution, which facilitates metal transfer. Since this process defines the position of the printed features on the customer substrate, the stamp must be placed with high precision (<250nm positional tolerance) while being subjected to high stamping loads.

The current technical development team for the stamp placement head is focussed on meeting the requirements to ensure high process yield (feature wetting, residual electrolyte thickness, etc.). The successful candidate in this role will become a crucial part of that project team, ensuring the technical development trajectory meets the requirements of the Achyon-1 high volume LEM machine with regards to stamp placement precision under load and overlay error introduced during stamp placement.

What we’re looking for

• You have been hands-on with the design and development of mechanical placement or imprint processes in semiconductor tooling; any processes where two parts are brought into precise, controlled contact with one another under load, e.g. bond or imprint heads in:
• Hybrid bonding and thermocompression bonding
• BESI, ASMPT, EVG, SUSS, Applied Materials and Kulicke & Soffa
• Nanoimprint lithography (UV-NIL, J-FIL and hot embossing)
• Canon, EVG, SUSS and Obducat
• Wafer-to-wafer bonding and bond alignment
• Flip-chip and advanced die attach
• Contact and proximity mask aligners
• You have designed, built and verified a high-load, precision mechanism holding sub-micron accuracy under hundreds of newtons or more. You lead the project from concept, prototype, and maturation all the way into a product or production tool, holding responsibility and accountability for the error budget throughout the design lifecycle.
• Experience with contamination control, design for cleanroom compatibility, and wet processing and corrosive chemical handling is highly regarded but not required.

Core Responsibilities

• Own one of our high precision placement modules incl. interfaces; engaging directly with our OEM partner and quantifying error budget entries for the module.
• Develop novel mechanical designs to achieve nanometer-scale stability, accuracy and repeatability, considering thermal expansion, dynamic vibration and structural responses under stamping loads.
• Deploy precision design fundamentals into all aspects of the placement system, including design for stiffness, flexure-mechanism synthesis, exact constraint design, metrology loop isolation and material selection.
• Perform mechanical analysis and simulation including structural, modal and thermal FEA, tolerance studies and hand calculations.
• Run your own prototyping; build, test and verify design candidates to accelerate learning loops.
• Generate engineering datapacks comprising engineering drawings including GD&T and documentation of analyses and design rationale.

Why Choose Syenta?

We’re passionate about building a diverse, people-first company. Our culture of collaboration and mutual respect fuels innovation capable of redefining an industry. At Syenta, you’ll have the opportunity to take ownership, lead high-impact teams, and shape the future of semiconductor manufacturing.

What We Offer

We offer a competitive remuneration package, including equity, that reflects your experience and the impact you'll have on our projects.

• Early-stage equity opportunities
• 12% superannuation contributions
• Flexible leave policies and a strong work-life balance
• Professional growth in a high-impact, fast-growing deep-tech startup
• Team events and collaborative culture, including company-wide gatherings in Australia